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Intel\u2019s chipmaking business may have run into a bit of a snag, as recent tests using the company\u2019s next-gen manufacturing process have failed, according to Reuters<\/em><\/a>.<\/p>\n<\/div>\n To carry out the tests, Intel reportedly sent Broadcom\u2019s silicon wafers \u2014 or the components used as a semiconductor\u2019s base \u2014 through its more efficient 18A manufacturing process. After examining the results, Broadcom found that the process isn\u2019t ready for high-volume production, Reuters<\/em> reports.<\/p>\n<\/div>\n \u201cIntel 18A is powered on, healthy and yielding well, and we remain fully on track to begin high volume manufacturing next year,\u201d an Intel spokesperson told Reuters<\/em>. \u201cThere is a great deal of interest in Intel 18A across the industry but, as a matter of policy, we do not comment on specific customer conversations.\u201d The Verge<\/em> reached out to Intel with a request for comment but didn\u2019t immediately hear back.<\/p>\n<\/div>\n Over the weekend, Reuters<\/em> reported<\/a> that Intel CEO Pat Gelsinger will soon pitch his plans to overhaul the company\u2019s spending and cut down on unnecessary assets. The company is reportedly considering selling off Altera, an Intel-owned business that creates programmable logic devices, and may pause work on its chipmaking factory in Germany<\/a>. Intel has already delayed the $20 billion plant<\/a> it has planned in Ohio.<\/p>\n<\/div>\n